Thermal cycling of shape memory alloy wires using semiconductor heat pump modules

Mark A. Thrasher

doi:10.1117/12.2298063

1 May 1992 Thermal cycling of shape memory alloy wires using semiconductor heat pump modules

Mark A. Thrasher

Proceedings Volume 1777, First European Conference on Smart Structures and Materials; 177714 (1992) https://doi.org/10.1117/12.2298063
Event: First European Conference on Smart Structures and Materials, 1992, Glasgow, United Kingdom

Abstract

This paper introduces a novel concept of using semiconductor heat pumpmodules to heat and cool Nitinol shape memory alloy (SMA) wires in an effort to reducethe response time for complete thermal cycling. An analytical heat transfer model isdeveloped to provide a quantitative comparison between the effectiveness of semiconductormodules and other conventional modes of heating and cooling SMA wires. Results of theheat transfer modeling indicate that semiconductor heat pump modules can reduceheating/cooling cycle time by an order of magnitude compared to free or forced convectionalone.

Citation Download Citation

Mark A. Thrasher "Thermal cycling of shape memory alloy wires using semiconductor heat pump modules", Proc. SPIE 1777, First European Conference on Smart Structures and Materials, 177714 (1 May 1992); https://doi.org/10.1117/12.2298063

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