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9 March 2023 Low loss cryogenic optical interconnects using photonic wire bonds
Thomas P. Dorch, Victoria Rosborough, Steven Estrella
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Proceedings Volume PC12427, Optical Interconnects XXIII; PC124270A (2023) https://doi.org/10.1117/12.2650659
Event: SPIE OPTO, 2023, San Francisco, California, United States
Abstract
Photonic technologies are being investigated to realize various next-generation devices, including quantum emitters, transducers and detectors, as well as classical devices, such as lasers, modulators, and detectors. A packaging approach that maintains high optical coupling efficiency over a wide temperature and broad wavelength range is needed for these devices and others. Photonic wire bonds (PWBs) may provide greater design flexibility, increased manufacturability, and higher tolerances to thermally driven misalignment at cryogenic temperatures. Freedom Photonics (a Luminar company) is developing high bandwidth optical interconnects for chip-to-chip or chip-to-fiber applications, utilizing PWBs to reduce optical loss at cryogenic temperatures.
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Thomas P. Dorch, Victoria Rosborough, and Steven Estrella "Low loss cryogenic optical interconnects using photonic wire bonds", Proc. SPIE PC12427, Optical Interconnects XXIII, PC124270A (9 March 2023); https://doi.org/10.1117/12.2650659
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KEYWORDS
Optical interconnects
Cryogenics
Signal attenuation
Optics manufacturing
Packaging
Sensors
Temperature metrology
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