Novel, Negative-Working Electron-Beam Resist

Z. C.H Tan; R. C. Daly; S. S. Georgia

doi:10.1117/12.941787

21 May 1984 Novel, Negative-Working Electron-Beam Resist

Z. C.H Tan, R. C. Daly, S. S. Georgia

Proceedings Volume 0469, Advances in Resist Technology I; (1984) https://doi.org/10.1117/12.941787
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

Previous work showed a poly(allyl methacrylate)-co-(2-hydroxyethyl methacrylate) copolymer to be a high-sensitivity, high-resolution, high-temperature-resistant negative-working electron-beam and x-ray resist. Although such a resist has been particularly use-ful, sensitivity to environmental conditions has been observed on occasion. For example, intermittent image-edge scaling and/or gross scumming have been encountered. Two approaches were considered to minimize the occurrence of these problems: proper handling and processing of the resist and a major change in the chemical structure of the copolymer. As part of the second approach, a novel copolymer was synthesized and evaluated as a negative electron-beam resist. This material is relatively free from the image-edge scaling and the gross scumming noted above. It provides high sensitivity, submicrometer resolution, and adequate plasma-etch resistance, and the development and exposure lati-tudes of the resist are very good. After postbaking at 170°C, the resist shows good resistance to both chemical and dry etching processes.

Citation Download Citation

Z. C.H Tan, R. C. Daly, and S. S. Georgia "Novel, Negative-Working Electron-Beam Resist", Proc. SPIE 0469, Advances in Resist Technology I, (21 May 1984); https://doi.org/10.1117/12.941787

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