Wafer-Scale Integration Of LiNbO3 Components For Coherent Optical Signal Processing

R. C. Booth; K. H. Cameron; P. G. Flavin; B. E. Daymond-John

doi:10.1117/12.945159

29 January 1985 Wafer-Scale Integration Of LiNbO3 Components For Coherent Optical Signal Processing

R. C. Booth, K. H. Cameron, P. G. Flavin, B. E. Daymond-John

Proceedings Volume 0517, Integrated Optical Circuit Engineering I; (1985) https://doi.org/10.1117/12.945159
Event: 1984 Cambridge Symposium, 1984, Cambridge, United States

Abstract

A novel CAD system for use in the manufacture of high resolution chrome masks for wafer scale integrated optic devices is described. The etching of titanium waveguide structures is considered and it is demonstrated that SF6, plasma etching techniques can be used to advantage. The packaging requirements of water scale integrated optic structures are out-lined and a novel fibre attachment technique described.

Citation Download Citation

R. C. Booth, K. H. Cameron, P. G. Flavin, and B. E. Daymond-John "Wafer-Scale Integration Of LiNbO3 Components For Coherent Optical Signal Processing", Proc. SPIE 0517, Integrated Optical Circuit Engineering I, (29 January 1985); https://doi.org/10.1117/12.945159

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