Paper
28 March 1986 Combining Thermographic, Environmental And Functional Testing For Characterization And Performance Measurement Of Electronic Devices And Assemblies
Herb Boulton
Author Affiliations +
Abstract
Thermography is certainly not a new science. For several decades, thermal imagers have been used to evaluate the performance of industrial systems and to diagnose problems which manifest themselves through the propagation of heat patterns. Many different types of thermal imagers have been produced to satisfy the requirements of a wide variety of applications. This paper discusses the design requirements and parameters of thermal imaging systems developed specifically for industrial applications, particularly those involving electronic device testing. It discusses the performance criteria required in thermography systems to adequately conduct conformance testing of electronic components and assemblies. The integration of thermography systems with other functional test equipment and with peripheral devices is reviewed, and the use of these systems in present and future industrial applications is discussed. Emphasis is placed on the cost effective use of thermography to improve yield, enhanced system reliability and provide the capability for developing performance documentation.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Herb Boulton "Combining Thermographic, Environmental And Functional Testing For Characterization And Performance Measurement Of Electronic Devices And Assemblies", Proc. SPIE 0581, Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control, (28 March 1986); https://doi.org/10.1117/12.950889
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Cited by 1 scholarly publication.
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KEYWORDS
Thermography

Imaging systems

Manufacturing

Capacitors

Reliability

Printed circuit board testing

Computing systems

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