High-Density Interconnects For Electronic Packaging

C W Eichelberger; R J Wojnarowski; R O Carlson; L M Levinson

doi:10.1117/12.943945

18 May 1988 High-Density Interconnects For Electronic Packaging

C W Eichelberger, R J Wojnarowski, R O Carlson, L M Levinson

Proceedings Volume 0877, Micro-Optoelectronic Materials; (1988) https://doi.org/10.1117/12.943945
Event: 1988 Los Angeles Symposium: O-E/LASE '88, 1988, Los Angeles, CA, United States

Abstract

High-density interconnect (HDI) is a unique, novel, hybrid approach currently in the development stages at the GE Research and Development Center. Our approach uses polymer layer overlays laminated over bare chips mounted on a substrate. The over-lays are laser-patterned with copper to connect the chips and I/O. The advantages of the HDI hybrid approach can be summarized as follows: •The overlay layer makes the entire chip area available for interconnect lines. •The interconnect has very high density: 2-mil pitch has been demonstrated. •Via and line formation are under computer control. Thus, no patterning mask is used. Chip misalignment is accommodated by computer-adaptive writing. •Copper is the conductor metallization. •The chips can be almost touching. •The interconnect technology accommodates any chip size and mixed chip technologies. •The process is ideal for prototype or moderate volume production. •The overlay can be removed and replaced without chip damage. •Chips are mounted directly on the substrate for good heat dissipation.

Citation Download Citation

C W Eichelberger, R J Wojnarowski, R O Carlson, and L M Levinson "High-Density Interconnects For Electronic Packaging", Proc. SPIE 0877, Micro-Optoelectronic Materials, (18 May 1988); https://doi.org/10.1117/12.943945

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