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1 January 1988 Thermal Processing Of Resist Materials: A Kinetic Approach
David H. Ziger, Gary L. Wolk
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Proceedings Volume 0920, Advances in Resist Technology and Processing V; (1988) https://doi.org/10.1117/12.968322
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States
Abstract
A kinetic approach to thermal processing of labile resist materials is proposed which compensates for non-isothermal heat treatments, run to run thermal variations and batch loading effects. This technique was used to control ammonia catalyzed image reversal processing and allowed consistent definition of 0.5μm and 0.6μm linear features using a g-line stepper equipped with 0.42 and 0.35 NA lenses respectively.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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David H. Ziger and Gary L. Wolk "Thermal Processing Of Resist Materials: A Kinetic Approach", Proc. SPIE 0920, Advances in Resist Technology and Processing V, (1 January 1988); https://doi.org/10.1117/12.968322
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