Electrical Measurement Of Submicrometer Contact Holes

B. J. Lin; J. A. Underhill; D. Sundling; B. Peck

doi:10.1117/12.968364

1 January 1988 Electrical Measurement Of Submicrometer Contact Holes

B. J. Lin, J. A. Underhill, D. Sundling, B. Peck

Proceedings Volume 0921, Integrated Circuit Metrology, Inspection, and Process Control II; (1988) https://doi.org/10.1117/12.968364
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

A special technique to electrically measure submicrometer isolated features is described. By incorporating a large number of features in a single test structure, a gain in precision better than 3 nm can be achieved. The interpreted contact hole diameter as well as the area of the isolated features were found to be very accurate. The special test pattern, an analytic expression for interpretation of the results, and hole size data from a variety of exposure dosages are included.

Citation Download Citation

B. J. Lin, J. A. Underhill, D. Sundling, and B. Peck "Electrical Measurement Of Submicrometer Contact Holes", Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); https://doi.org/10.1117/12.968364

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