Optoelectronic packaging of single photon avalanche diodes

S. Mahnkopf; A. Giudice; D. Demmer; T. Haslett; G. Simmerle

doi:10.1117/12.2255556

27 February 2017 Optoelectronic packaging of single photon avalanche diodes

S. Mahnkopf, A. Giudice, D. Demmer, T. Haslett, G. Simmerle

Proceedings Volume 10085, Components and Packaging for Laser Systems III; 100850C (2017) https://doi.org/10.1117/12.2255556
Event: SPIE LASE, 2017, San Francisco, California, United States

Abstract

Optical and mechanical aspects of packaging single photon avalanche diodes for different applications will be discussed. Particular emphasis will be given to fiber coupling at high photon detection efficiencies over a wide wavelength range.

Conference Presentation

Citation Download Citation

S. Mahnkopf, A. Giudice, D. Demmer, T. Haslett, and G. Simmerle "Optoelectronic packaging of single photon avalanche diodes", Proc. SPIE 10085, Components and Packaging for Laser Systems III, 100850C (27 February 2017); https://doi.org/10.1117/12.2255556

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