Paper
27 March 2017 Effects of phenolic compound addition to fractionated Novolak-based resists to improve resolution capability(2)
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Abstract
Novolak resists have been widely used in IC production and are used to this day in the production of flat panel displays (FPDs) and MEMS. However, with the advent of high-definition devices, FPDs must meet growing requirements for finer dimensions. These trends have generated requirements for higher sensitivity, higher resolution, and wider process margins for novolak resists. Using a lithography simulator with the goal of improving the performance of novolak resists, we examined various approaches to improving resist materials. This report discusses efforts to improve resolution and to broaden process margins using a novolak resin that exhibits a higher degree of fractionation than in the previous report (maximum fractionated resin) with the addition of low molecular weight phenol resins.
© (2017) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Atsushi Sekiguchi, Yoko Matsumoto, Yoshihisa Sensu, Satoshi Takei, Makoto Hanabata, and Hatsuyuki Tanaka "Effects of phenolic compound addition to fractionated Novolak-based resists to improve resolution capability(2)", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101461K (27 March 2017); https://doi.org/10.1117/12.2257548
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KEYWORDS
Picture Archiving and Communication System

Lithography

Electroluminescence

Optical lithography

Flat panel displays

Microelectromechanical systems

Polymers

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