Design space analysis of novel interconnect constructs for 22nm FDX technology

Tuhin Guha Neogi; Navneet Jain; Piyush Verma; David Permana; Andrey Lutich; Francois Weishbuch; Deepal Wehella-Gamage; Benoit Francois Claude Ramadout; Gowtham Vangara; Juhan Kim; Thomas Herrmann; Kai Sun; Katherina Babich; David Pritchard; Mahbub Rashed

doi:10.1117/12.2258668

30 March 2017 Design space analysis of novel interconnect constructs for 22nm FDX technology

Tuhin Guha Neogi, Navneet Jain, Piyush Verma, David Permana, Andrey Lutich, Francois Weishbuch, Deepal Wehella-Gamage, Benoit Francois Claude Ramadout, Gowtham Vangara, Juhan Kim, Thomas Herrmann, Kai Sun, Katherina Babich, David Pritchard, Mahbub Rashed

Author Affiliations +

Proceedings Volume 10148, Design-Process-Technology Co-optimization for Manufacturability XI; 101480Z (2017) https://doi.org/10.1117/12.2258668
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

In this paper, we describe an integrated design space analysis approach consisting of full factorial layout generation, lithography simulations with added proximity effects, and rigorous statistical analysis through monte-carlo simulations which is used in the evaluating interconnects. This agile Design rule development process provides a quick turnaround time to down-select the potential layout configurations that can offer a competitive, robust and reliable design and manufacturing. Further layout and placement optimization is carried out to evaluate intra-cell, inter-cell and cell boundary situations, which are critical for a place and routed block. These interconnects developed using the integrated approach has been the key contributor to give 20-30% higher performance at the same Iddq leakage for 8T libraries compared to Single Diffusion break or Double Diffusion break based 12T libraries in 22FDX Technology.

Citation Download Citation

Tuhin Guha Neogi, Navneet Jain, Piyush Verma, David Permana, Andrey Lutich, Francois Weishbuch, Deepal Wehella-Gamage, Benoit Francois Claude Ramadout, Gowtham Vangara, Juhan Kim, Thomas Herrmann, Kai Sun, Katherina Babich, David Pritchard, and Mahbub Rashed "Design space analysis of novel interconnect constructs for 22nm FDX technology", Proc. SPIE 10148, Design-Process-Technology Co-optimization for Manufacturability XI, 101480Z (30 March 2017); https://doi.org/10.1117/12.2258668

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE