Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice

T. Bieniek; G. Janczyk; R. Dobrowolski; K. Wojciechowska; A. Malinowska; A. Panas; M. Nieprzecki; H. Kłos

doi:10.1117/12.2244299

10 November 2016 Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice

T. Bieniek, G. Janczyk, R. Dobrowolski, K. Wojciechowska, A. Malinowska, A. Panas, M. Nieprzecki, H. Kłos

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Proceedings Volume 10161, 14th International Conference on Optical and Electronic Sensors; 1016103 (2016) https://doi.org/10.1117/12.2244299
Event: 14th International Conference on Optical and Electronic Sensors, 2016, Gdansk, Poland

Abstract

This paper covers research results on development of the cantilevers beams test structures for interconnects reliability and robustness investigation. Presented results include design, modelling, simulation, optimization and finally fabrication stage performed on 4 inch Si wafers using the ITE microfabrication facility. This paper also covers experimental results from the test structures characterization.

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T. Bieniek, G. Janczyk, R. Dobrowolski, K. Wojciechowska, A. Malinowska, A. Panas, M. Nieprzecki, and H. Kłos "Functionalization of MEMS cantilever beams for interconnect reliability investigation: development practice", Proc. SPIE 10161, 14th International Conference on Optical and Electronic Sensors, 1016103 (10 November 2016); https://doi.org/10.1117/12.2244299

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