Translator Disclaimer
Paper
22 December 2016 Voiding in lead-free soldering of components with large solder pads
Author Affiliations +
Proceedings Volume 10175, Electron Technology Conference 2016; 1017506 (2016) https://doi.org/10.1117/12.2258608
Event: Electron Technology Conference ELTE 2016, 2016, Wisla, Poland
Abstract
The paper presents the quantification of void formation in lead-free solder joints underneath bottom terminated components (BTCs) through X-ray inspection. Experiments were designed to investigate how void formation is affected by using vacuum in reflow soldering on the example of light emitted diode (LED) packages on metal core printed circuit boards (PCBs). Convection and vapour phase reflow soldering were used for LED assembly. X-ray inspection system analyzed the statistical distribution, mean value, standard deviation and process capability value Cpk of thermal pads coverage for various technological versions of LEDs.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Barbara Dziurdzia and Janusz Mikołajek "Voiding in lead-free soldering of components with large solder pads", Proc. SPIE 10175, Electron Technology Conference 2016, 1017506 (22 December 2016); https://doi.org/10.1117/12.2258608
PROCEEDINGS
7 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Application of carbon nanoclusters in electronics
Proceedings of SPIE (April 26 2018)
Reducing the shot counts of mask writing with OPC by...
Proceedings of SPIE (September 23 2009)
Contraband detection program
Proceedings of SPIE (February 17 1997)
Automatic SMT Inspection With -X-Ray Vision
Proceedings of SPIE (March 12 1988)
Focused ion beams for x-ray mask repair
Proceedings of SPIE (November 03 1994)

Back to Top