Silicon wafer directly used as an output coupler in Tm:YAP laser

Xikui Ren; Chenlin Du; Li Yu; Junqing Zhao; Yewang Chen; Shuangchen Ruan

doi:10.1117/12.2270458

20 February 2017 Silicon wafer directly used as an output coupler in Tm:YAP laser

Xikui Ren, Chenlin Du, Li Yu, Junqing Zhao, Yewang Chen, Shuangchen Ruan

Proceedings Volume 10328, Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics; 103280E (2017) https://doi.org/10.1117/12.2270458
Event: 31st International Congress on High-Speed Imaging and Photonics, 2016, Osaka, Japan

Abstract

A high power diode-pumped continuous-wave Tm:YAP laser with a piece of silicon chip as the output coupler (Si-OC) is demonstrated. A maximum output power of 13 W with a beam quality of M² ≤ 1.45 at 1931 nm was obtained, corresponding to an optical-to-optical efficiency of 31%, and a slope efficiency of 33%. To our best knowledge, this is the first report of utilizing silicon as a output coupler on solid Tm:YAP laser system. The mechanism of silicon output coupler on Tm:YAP laser is also discussed in this letter. Because of the intriguing characteristics of silicon, such as high damage threshold, low cost and long-pass filter property, double-sided polishing single crystal silicon chip can perform as a good output coupler in high power laser system near 2 μm region.

Citation Download Citation

Xikui Ren, Chenlin Du, Li Yu, Junqing Zhao, Yewang Chen, and Shuangchen Ruan "Silicon wafer directly used as an output coupler in Tm:YAP laser", Proc. SPIE 10328, Selected Papers from the 31st International Congress on High-Speed Imaging and Photonics, 103280E (20 February 2017); https://doi.org/10.1117/12.2270458

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