Optical inspection of hidden MEMS structures

Johann Krauter; Marc Gronle; Wolfgang Osten

doi:10.1117/12.2269499

26 June 2017 Optical inspection of hidden MEMS structures

Johann Krauter, Marc Gronle, Wolfgang Osten

Proceedings Volume 10329, Optical Measurement Systems for Industrial Inspection X; 1032914 (2017) https://doi.org/10.1117/12.2269499
Event: SPIE Optical Metrology, 2017, Munich, Germany

Abstract

Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

Citation Download Citation

Johann Krauter, Marc Gronle, and Wolfgang Osten "Optical inspection of hidden MEMS structures", Proc. SPIE 10329, Optical Measurement Systems for Industrial Inspection X, 1032914 (26 June 2017); https://doi.org/10.1117/12.2269499

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