Opto-Mechanical Packaging For Extended Temperature Performance

Scott Enochs

doi:10.1117/12.976389

22 June 1989 Opto-Mechanical Packaging For Extended Temperature Performance

Scott Enochs

Proceedings Volume 1043, Laser Diode Technology and Applications; (1989) https://doi.org/10.1117/12.976389
Event: OE/LASE '89, 1989, Los Angeles, CA, United States

Abstract

The ability of a laser diode module package to maintain precise laser-to-fiber alignment with mechanical stress or temperature change is critical for stable performance. This paper examines an optical-mechanical package configuration in which both laser and fiber are mounted on the same surface with high-temperature solder, thereby minimizing degraded package performance caused by exteraneous thermal or mechanical changes.

Citation Download Citation

Scott Enochs "Opto-Mechanical Packaging For Extended Temperature Performance", Proc. SPIE 1043, Laser Diode Technology and Applications, (22 June 1989); https://doi.org/10.1117/12.976389

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