Process window discovery from mask inspection for hotspot analysis and verification

James Cheng; William Chou; C. H. Twu; Hsin-Fu Chou; Jackie Cheng; Colbert Lu; Heng-Jen Lee; Bosheng Zhang; Mehdi Daneshpanah; Apo Sezginer; David Wu; Mike Yeh; Albert Chien

doi:10.1117/12.2281215

16 October 2017 Process window discovery from mask inspection for hotspot analysis and verification

James Cheng, William Chou, C. H. Twu, Hsin-Fu Chou, Jackie Cheng, Colbert Lu, Heng-Jen Lee, Bosheng Zhang, Mehdi Daneshpanah, Apo Sezginer, David Wu, Mike Yeh, Albert Chien

Author Affiliations +

Proceedings Volume 10451, Photomask Technology 2017; 104510X (2017) https://doi.org/10.1117/12.2281215
Event: SPIE Photomask Technology and EUV Lithography, 2017, Monterey, California, United States

Abstract

A new technology transforms mask inspection images through focus into 3D lithography images in resist. This enables early detection and ranking of hotspots, and distinguishes mask-induced and process-induced hotspots. The results can be used in several ways including: 1) feed back to OPC teams to improve process window; 2) feed forward to the litho team for scanner adjustment; and, 3) feed forward to wafer inspection in the form of care areas to reduce time to result for wafer-based process window discovery.

Citation Download Citation

James Cheng, William Chou, C. H. Twu, Hsin-Fu Chou, Jackie Cheng, Colbert Lu, Heng-Jen Lee, Bosheng Zhang, Mehdi Daneshpanah, Apo Sezginer, David Wu, Mike Yeh, and Albert Chien "Process window discovery from mask inspection for hotspot analysis and verification", Proc. SPIE 10451, Photomask Technology 2017, 104510X (16 October 2017); https://doi.org/10.1117/12.2281215

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