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24 October 2017 Subsurface damage distribution and processing method of ground fused silica
Heng Zhao, Chao Cai, Wang Gang, Xiang He, Qing Hu, Ping Ma
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Proceedings Volume 10457, AOPC 2017: Laser Components, Systems, and Applications; 1045724 (2017) https://doi.org/10.1117/12.2284768
Event: Applied Optics and Photonics China (AOPC2017), 2017, Beijing, China
Abstract
Subsurface damage (SSD) has been identified as a main initiator of laser-induced damage in fused silica, and the most of SSD is produced during grinding process. The distribution and morphology of SSD in fused silica samples ground with loose abrasive are investigated by magneto-rheological finishing (MRF) dimpling and buffered oxide etch (BOE) etching method. The results demonstrate that the SSD depth is most responsive to the loose abrasive size and the BOE etching is good for removing the SSD. Based on these results, an efficient grinding technique combined with BOE etching is proposed to reduce the SSD of fused silica, and the damage threshold is obviously improved by this routine as a result.
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Heng Zhao, Chao Cai, Wang Gang, Xiang He, Qing Hu, and Ping Ma "Subsurface damage distribution and processing method of ground fused silica", Proc. SPIE 10457, AOPC 2017: Laser Components, Systems, and Applications, 1045724 (24 October 2017); https://doi.org/10.1117/12.2284768
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KEYWORDS
Silica
Abrasives
Etching
Laser damage threshold
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