High temperature semiconductor diode laser pumps for high energy laser applications

Jenna Campbell; Tadej Semenic; Keith Guinn; Paul O. Leisher; Avijit Bhunia; Milan Mashanovitch; Daniel Renner

doi:10.1117/12.2288600

20 February 2018 High temperature semiconductor diode laser pumps for high energy laser applications

Jenna Campbell, Tadej Semenic, Keith Guinn, Paul O. Leisher, Avijit Bhunia, Milan Mashanovitch, Daniel Renner

Proceedings Volume 10513, Components and Packaging for Laser Systems IV; 105130O (2018) https://doi.org/10.1117/12.2288600
Event: SPIE LASE, 2018, San Francisco, California, United States

Abstract

Existing thermal management technologies for diode laser pumps place a significant load on the size, weight and power consumption of High Power Solid State and Fiber Laser systems, thus making current laser systems very large, heavy, and inefficient in many important practical applications. To mitigate this thermal management burden, it is desirable for diode pumps to operate efficiently at high heat sink temperatures. In this work, we have developed a scalable cooling architecture, based on jet-impingement technology with industrial coolant, for efficient cooling of diode laser bars. We have demonstrated 60% electrical-to-optical efficiency from a 9xx nm two-bar laser stack operating with propylene-glycolwater coolant, at 50 °C coolant temperature. To our knowledge, this is the highest efficiency achieved from a diode stack using 50 °C industrial fluid coolant. The output power is greater than 100 W per bar. Stacks with additional laser bars are currently in development, as this cooler architecture is scalable to a 1 kW system. This work will enable compact and robust fiber-coupled diode pump modules for high energy laser applications.

Citation Download Citation

Jenna Campbell, Tadej Semenic, Keith Guinn, Paul O. Leisher, Avijit Bhunia, Milan Mashanovitch, and Daniel Renner "High temperature semiconductor diode laser pumps for high energy laser applications", Proc. SPIE 10513, Components and Packaging for Laser Systems IV, 105130O (20 February 2018); https://doi.org/10.1117/12.2288600

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available