Breaking the mold of photonic packaging

Tymon Barwicz; Ted W. Lichoulas; Yoichi Taira; Yves Martin; Shotaro Takenobu; Alexander Janta-Polczynski; Hidetoshi Numata; Eddie L. Kimbrell; Jae-Woong Nah; Bo Peng; Darrell Childers; Robert Leidy; Marwan Khater; Swetha Kamlapurkar; Elaine Cyr; Sebastian Engelmann; Paul Fortier; Nicolas Boyer

doi:10.1117/12.2290230

23 February 2018 Breaking the mold of photonic packaging

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer

Author Affiliations +

Proceedings Volume 10535, Integrated Optics: Devices, Materials, and Technologies XXII; 105350R (2018) https://doi.org/10.1117/12.2290230
Event: SPIE OPTO, 2018, San Francisco, California, United States

Abstract

The packaging of photonic devices remains a hindering challenge to the deployment of integrated photonic modules. This is never as true as for silicon photonic modules where the cost efficiency and scalability of chip fabrication in microelectronic production facilities is far ahead of current photonic packaging technology. More often than not, photonic modules are still packaged today with legacy manual processes and high-precision active alignment. Automation of these manual processes can provide gains in yield and scalability. Thus, specialized automated equipment has been developed for photonic packaging, is now commercially available, and is providing an incremental improvement in cost and scalability. However, to bring the cost and scalability of photonic packaging on par with silicon chip fabrication, we feel a more disruptive approach is required. Hence, in recent years, we have developed photonic packaging in standard, highthroughput microelectronic packaging facilities. This approach relies on the concepts already responsible for the attractiveness of silicon photonic chip fabrication: (1) moving complexity from die-level packaging processes to waferlevel planar fabrication, and (2) leveraging the scale of existing microelectronic facilities for photonic fabrication. We have demonstrated such direction with peak coupling performance of 1.3 dB from standard cleaved fiber to chip and 1.1 dB from chip to chip.

Conference Presentation

Citation Download Citation

Tymon Barwicz, Ted W. Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie L. Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, and Nicolas Boyer "Breaking the mold of photonic packaging", Proc. SPIE 10535, Integrated Optics: Devices, Materials, and Technologies XXII, 105350R (23 February 2018); https://doi.org/10.1117/12.2290230

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