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22 February 2018 Hybrid integrated single-wavelength laser with silicon micro-ring reflector
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Proceedings Volume 10537, Silicon Photonics XIII; 105370N (2018) https://doi.org/10.1117/12.2290620
Event: SPIE OPTO, 2018, San Francisco, California, United States
Abstract
A hybrid integrated single-wavelength laser with silicon micro-ring reflector is demonstrated theoretically and experimentally. It consists of a heterogeneously integrated III-V section for optical gain, an adiabatic taper for light coupling, and a silicon micro-ring reflector for both wavelength selection and light reflection. Heterogeneous integration processes for multiple III-V chips bonded to an 8-inch Si wafer have been developed, which is promising for massive production of hybrid lasers on Si. The III-V layer is introduced on top of a 220-nm thick SOI layer through low-temperature wafer-boning technology. The optical coupling efficiency of >85% between III-V and Si waveguide has been achieved. The silicon micro-ring reflector, as the key element of the hybrid laser, is studied, with its maximized reflectivity of 85.6% demonstrated experimentally. The compact single-wavelength laser enables fully monolithic integration on silicon wafer for optical communication and optical sensing application.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Min Ren, Jing Pu, Vivek Krishnamurthy, Zhengji Xu, Chee-Wei Lee, Dongdong Li, Leonard Gonzaga, Yeow T. Toh, Febi Tjiptoharsono, and Qian Wang "Hybrid integrated single-wavelength laser with silicon micro-ring reflector", Proc. SPIE 10537, Silicon Photonics XIII, 105370N (22 February 2018); https://doi.org/10.1117/12.2290620
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