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22 February 2018Hybrid integrated single-wavelength laser with silicon micro-ring reflector
A hybrid integrated single-wavelength laser with silicon micro-ring reflector is demonstrated theoretically and
experimentally. It consists of a heterogeneously integrated III-V section for optical gain, an adiabatic taper for light
coupling, and a silicon micro-ring reflector for both wavelength selection and light reflection. Heterogeneous integration
processes for multiple III-V chips bonded to an 8-inch Si wafer have been developed, which is promising for massive
production of hybrid lasers on Si. The III-V layer is introduced on top of a 220-nm thick SOI layer through low-temperature
wafer-boning technology. The optical coupling efficiency of >85% between III-V and Si waveguide has
been achieved. The silicon micro-ring reflector, as the key element of the hybrid laser, is studied, with its maximized
reflectivity of 85.6% demonstrated experimentally. The compact single-wavelength laser enables fully monolithic
integration on silicon wafer for optical communication and optical sensing application.