Paper
22 February 2018 Super-resolution critical dimension limits of positive tone i-line photoresists
Author Affiliations +
Abstract
Applying a technique borrowed from super-resolution microscopy to photolithography, we achieve critical dimensions well below the diffraction limit. Exposing photoresist in the far-field, over a broad area, we can demonstrate dimensions as small as λ/7. In this paper, we show that conventional i-line photoresists exposed with this technique, along with modified processing, are capable of supporting features as small as 50 nm, and possibly smaller. We consider the necessary requirements to achieve sub-diffraction dimensions, detail a simple model for photoresist development, and show its use in predicting the minimum attainable feature size. Finally, we characterize two commercial photoresists, and compare the resulting features to those of the model.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David B. Miller, Adam M. Jones, and Robert R. McLeod "Super-resolution critical dimension limits of positive tone i-line photoresists", Proc. SPIE 10544, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XI, 105440N (22 February 2018); https://doi.org/10.1117/12.2287470
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Photoresist materials

Photoresist developing

Image enhancement

Line edge roughness

Lithography

Optical lithography

Super resolution

Back to Top