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22 February 2018 Integration and biocompatible packaging of multi-modal endoscopic imagers using 3D glass micro structuring
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Proceedings Volume 10545, MOEMS and Miniaturized Systems XVII; 105450Q (2018)
Event: SPIE OPTO, 2018, San Francisco, California, United States
Multi-modal endomicroscopy is one of the most promising means to enable optical biopsy methods to attain the specificity and selectivity of conventional biopsy. However, the development of the complex opto-mechanical systems needs very high assembly tolerances, and robust, biocompatible and ultra-slim packaging solutions. Therefore, the prototyping and low-volume manufacturing of multi-modal endomicroscopes are often costly and time intensive processes.

We present the opto-mechanical design of a novel endomicroscope combining wide-field microscopy and 3D OCT, and demonstrate the advantages of 3D glass micro structuring based assembly and packaging in terms of optical performance and device miniaturization. Using ray-tracing based Monte Carlo simulations, we demonstrate that this precision leads to a significantly better optical performance compared to that offered by rival 3D machining techniques, such as the state-of-the-art 3D polymer printers and conventional micromachining based solutions.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Simon Kretschmer, Jan Jäger, Sergio Vilches, Çağlar Ataman, and Hans Zappe "Integration and biocompatible packaging of multi-modal endoscopic imagers using 3D glass micro structuring", Proc. SPIE 10545, MOEMS and Miniaturized Systems XVII, 105450Q (22 February 2018);

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