Paper
29 January 2018 Bend-insensitive optical fiber with high-mechanical reliability for silicon photonic packaging
Ming-Jun Li, Jeffery Stone, Kevin Bennett, Clifford Sutton, Douglas Butler
Author Affiliations +
Abstract
In this paper, we propose bend insensitive fiber designs that can meet both the bend loss and mechanical reliability needs for silicon photonic packaging. To improve the bend loss, we adopt profile designs with a low index trench that allow us to reduce the bending loss while keeping the mode field diameter compatible with the standard single mode fiber. To improve the mechanical reliability, we put a Titania-doped glass layer on the surface of the fiber cladding, which improves the fiber reliability under tight bending conditions. We describe both the core and Titania layer designs and present results on fiber optical and mechanical performances.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ming-Jun Li, Jeffery Stone, Kevin Bennett, Clifford Sutton, and Douglas Butler "Bend-insensitive optical fiber with high-mechanical reliability for silicon photonic packaging", Proc. SPIE 10559, Broadband Access Communication Technologies XII, 105590M (29 January 2018); https://doi.org/10.1117/12.2299510
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CITATIONS
Cited by 1 scholarly publication.
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KEYWORDS
Reliability

Packaging

Silicon photonics

Optical fibers

Glasses

Cladding

Single mode fibers

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