Paper
13 March 2018 Cutting edge multiple beam technology for EUV era: latest development progress and application
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Abstract
In this paper, we focus on our most advanced multiple beam technology and next generation multiple beam inspector(MBI) development. We have successfully got 9 images on primary beam module, proving our design concept is correct. We also discussed related technologies, e.g. Computation and fast stage technology to further improve throughput and lower COO. At last MBI new applications are discussed.
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Eric Ma, Kevin Chou, Xuedong Liu, Weiming Ren, Xuerang Hu, Fei Wang, and Kevin Liu "Cutting edge multiple beam technology for EUV era: latest development progress and application", Proc. SPIE 10585, Metrology, Inspection, and Process Control for Microlithography XXXII, 1058535 (13 March 2018); https://doi.org/10.1117/12.2323183
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KEYWORDS
Inspection

Extreme ultraviolet

Photomasks

Computing systems

Image processing

Semiconducting wafers

Image quality

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