The optical design of  3D ICs for smartphone and optro-electronics sensing module

Jiun-Woei Huang

doi:10.1117/12.2297335

20 March 2018 The optical design of 3D ICs for smartphone and optro-electronics sensing module

Jiun-Woei Huang

Proceedings Volume 10587, Optical Microlithography XXXI; 1058717 (2018) https://doi.org/10.1117/12.2297335
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

Smartphone require limit space for image system, current lens, used in smartphones are refractive type, the effective focal length is limited the thickness of phone physical size. Other, such as optro-electronics sensing chips, proximity optical sensors, and UV indexer chips are integrated into smart phone with limit space. Due to the requirement of multiple lens in smartphone, proximity optical sensors, UV indexer and other optro-electronics sensing chips in a limited space of CPU board in future smart phone, optro-electronics 3D IC’s integrated with optical lens or components may be a key technology for 3 C products. A design for reflective lens is fitted to CMOS, proximity optical sensors, UV indexer and other optro-electronics sensing chips based on 3-D IC. The reflective lens can be threes times of effective focal lens, and be able to resolve small object. The system will be assembled and integrated in one 3-D IC more easily.

Citation Download Citation

Jiun-Woei Huang "The optical design of 3D ICs for smartphone and optro-electronics sensing module", Proc. SPIE 10587, Optical Microlithography XXXI, 1058717 (20 March 2018); https://doi.org/10.1117/12.2297335

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