Thick film resistors (TFRs) were screen-printed and fired on fluorophlogopite glass ceramic (FGC) and alumina ceramic substrate as smart aggregates. Performances of smart aggregates under compressive load were tested before and after embedded in mortar specimens. Compared to alumina ceramic substrate, the TFRs on FGC shows better compatibility and matching performance, the matching error between sensor and mortar decreased from 0.734 to 0.187, the output strain ratio between sensor and mortar increased from 0.0837 to 0.421, and the test results confirmed the theoretical calculation results. When embedded in mortar, the TFRs on FGC shows better repeatability than that on alumina ceramic under repeated compressive load.
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