You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
1 December 2017Thin films structural properties: results of the full-atomistic supercomputer simulation
The previously developed full-atomistic approach to the thin film growth simulation is applied for the
investigation of the dependence of silicon dioxide films properties on deposition conditions. It is shown that the surface
roughness and porosity are essentially reduced with the growth of energy of deposited silicon atoms. The growth of
energy from 0.1 eV to 10 eV results in the increase of the film density for 0.2 - 0.4 g/cm3 and of the refractive index for
0.04-0.08. The compressive stress in films structures is observed for all deposition conditions. Absolute values of the
stress tensor components increase with the growth of e energy of deposited atoms. The increase of the substrate
temperature results in smoothing of the density profiles of the deposited films.
The alert did not successfully save. Please try again later.
F. V. Grigoriev, V. B. Sulimov, A. V. Tikhonravov, "Thin films structural properties: results of the full-atomistic supercomputer simulation
," Proc. SPIE 10603, Photonics, Devices, and Systems VII, 106030F (1 December 2017); https://doi.org/10.1117/12.2292420