Thermal and mechanical design of SPICA payload module

Hiroyuki Ogawa; Takao Nakagawa; Hideo Matsuhara; Chihiro Tokoku; Mitsunobu Kawada; Ken Goto; Shinsuke Takeuchi; Masaru Saijo; Keisuke Shinozaki; Yohichi Sato; Tadahito Mizutani; Hidehiro Kaneda; Hiroshi Shibai

doi:10.1117/12.2313308

24 July 2018 Thermal and mechanical design of SPICA payload module

Hiroyuki Ogawa, Takao Nakagawa, Hideo Matsuhara, Chihiro Tokoku, Mitsunobu Kawada, Ken Goto, Shinsuke Takeuchi, Masaru Saijo, Keisuke Shinozaki, Yohichi Sato, Tadahito Mizutani, Hidehiro Kaneda, Hiroshi Shibai

Author Affiliations +

Proceedings Volume 10698, Space Telescopes and Instrumentation 2018: Optical, Infrared, and Millimeter Wave; 106980B (2018) https://doi.org/10.1117/12.2313308
Event: SPIE Astronomical Telescopes + Instrumentation, 2018, Austin, Texas, United States

Abstract

We present an overview of the thermal and mechanical design of the Payload Module (PLM) of the next- generation infrared astronomy mission Space Infrared Telescope for Cosmology and Astrophysics (SPICA). The primary design goal of PLM is to cool the whole science assembly including a 2.5 m telescope and focal-plane instruments below 8 K. SPICA is thereby expected to have very low background conditions so that it can achieve unprecedented sensitivity in the mid- and far-infrared. PLM also provides the instruments with the 4.8 K and 1.8 K stages to cool their detectors. The SPICA cryogenic system combines passive, effective radiative cooling by multiple thermal shields and active cooling by a series of mechanical cryocoolers. The mechanical cryocoolers are required to provide 40 mW cooling power at 4.8 K and 10 mW at 1.8 K at End-of-Life (EoL). End-to-end performance of the SPICA cryocooler-chain from 300 K to 50 mK was demonstrated under the framework of the ESA CryoChain Core Technology Program (CC-CTP). In this paper, we focus on the recent progress of the thermal and mechanical design of SPICA PLM which is based on the SPICA mission proposal to ESA.

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Hiroyuki Ogawa, Takao Nakagawa, Hideo Matsuhara, Chihiro Tokoku, Mitsunobu Kawada, Ken Goto, Shinsuke Takeuchi, Masaru Saijo, Keisuke Shinozaki, Yohichi Sato, Tadahito Mizutani, Hidehiro Kaneda, and Hiroshi Shibai "Thermal and mechanical design of SPICA payload module", Proc. SPIE 10698, Space Telescopes and Instrumentation 2018: Optical, Infrared, and Millimeter Wave, 106980B (24 July 2018); https://doi.org/10.1117/12.2313308

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