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18 September 2018 Fabrication of high aspect ratio silicon and diamond for x-ray optics (Conference Presentation)
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High aspect ratio silicon was fabricated by metal-assisted chemical etching (MACE). We have fabricated zone plate with 16 nm outermost zone width and 8 μm thickness, thus achieving a very high aspect ratio up to 500. Such zone plates have the potential for high efficiency and fine spatial resolution for x-ray nanofocusing applications. High aspect ratio diamond was fabricated by reactive ion etching (RIE). We have fabricated diamond gratings with 300 nm half-pitch and more than 10 μm thickness. Diamond has more thermal conductivity than silicon. Such gratings could be used as x-ray beam splitter for free-electron laser.
Conference Presentation
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kenan Li "Fabrication of high aspect ratio silicon and diamond for x-ray optics (Conference Presentation)", Proc. SPIE 10730, Nanoengineering: Fabrication, Properties, Optics, and Devices XV, 107300I (18 September 2018);


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