Paper
9 October 2018 Digital uncooled IRFPAs based on microbolometers with 17 μm and 12 μm pixel pitch
Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin D. Michel, Andreas Kuhl, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt
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Abstract
This paper presents the results of high-performance infrared detectors (IRFPA – InfraRed Focal Plane Array) based on uncooled microbolometers with 17 μm and 12 μm pixel pitch and a chip-scale-package as the vacuum package developed and fabricated by Fraunhofer-IMS. Like CMOS image sensor IRFPAs also have been following the trend of reducing the pixel size in order to reduce the costs and increase the optical resolution. For microbolometer based uncooled IRFPA the pixel pitch has been reduced from 35 μm pixel pitch ten years ago via 25 μm and 17 μm down to 12 μm. Fraunhofer IMS has developed digital IRFPAs featuring a direct conversion of the microbolometer’s resistance into a 16 bit value by the use of massively parallel on-chip Sigma-Delta-ADCs achieving a high scene temperature dynamic range of more than 300 K and a very low NETD-value below 50 mK. Due to a broad-band antireflection coating the digital IRFPAs achieve a high sensitivity in the LWIR (wavelength 8 μm to 14 μm) and MWIR (wavelength 3 μm to 5 μm) range. In this paper the microbolometer, the vacuum-packaging, the architecture of the readout electronics, and the electro-optical performance characterization will be presented.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin D. Michel, Andreas Kuhl, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, and Holger Vogt "Digital uncooled IRFPAs based on microbolometers with 17 μm and 12 μm pixel pitch", Proc. SPIE 10795, Electro-Optical and Infrared Systems: Technology and Applications XV, 1079504 (9 October 2018); https://doi.org/10.1117/12.2503423
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KEYWORDS
Microbolometers

Readout integrated circuits

Sensors

Temperature metrology

Black bodies

Thermography

Infrared radiation

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