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4 March 2019 Comparative study between wet and dry etching of silicon for microchannels fabrication
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Abstract
In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 μm.
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G. A. Cirino, L. A. M. Barea, R. D. Mansano, P. Verdonck, A. von Zuben, N. C. Frateschi, and J. A. Diniz "Comparative study between wet and dry etching of silicon for microchannels fabrication", Proc. SPIE 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII, 1093015 (4 March 2019); https://doi.org/10.1117/12.2506804
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