Comparative study between wet and dry etching of silicon for microchannels fabrication

G. A. Cirino; L. A. M. Barea; R. D. Mansano; P. Verdonck; A. von Zuben; N. C. Frateschi; J. A. Diniz

doi:10.1117/12.2506804

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4 March 2019 Comparative study between wet and dry etching of silicon for microchannels fabrication

G. A. Cirino, L. A. M. Barea, R. D. Mansano, P. Verdonck, A. von Zuben, N. C. Frateschi, J. A. Diniz

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Proceedings Volume 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII; 1093015 (2019) https://doi.org/10.1117/12.2506804
Event: SPIE OPTO, 2019, San Francisco, California, United States

Abstract

In this work we present a comparative study of two processes for the fabrication of an array of microchannels for microfluidics applications, based on integrated-circuit technology process steps, such as lithography and dry etching. Two different methods were investigated in order to study the resulting microstructures: wet and dry deep etching of silicon substrate. The typical etching depth necessary to the target application is 50 μm.

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G. A. Cirino, L. A. M. Barea, R. D. Mansano, P. Verdonck, A. von Zuben, N. C. Frateschi, and J. A. Diniz "Comparative study between wet and dry etching of silicon for microchannels fabrication", Proc. SPIE 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII, 1093015 (4 March 2019); https://doi.org/10.1117/12.2506804

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