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15 November 2018 Femtosecond laser cutting ultra thin fused silica
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Proceedings Volume 10964, Tenth International Conference on Information Optics and Photonics; 109644Y (2018) https://doi.org/10.1117/12.2506222
Event: Tenth International Conference on Information Optics and Photonics (CIOP 2018), 2018, Beijing, China
Abstract
Cutting of ultra thin fused silica sheets is a significant technological challenge because of these materials’ brittleness and high ablation threshold. Femtosecond laser offer a great prospect for meeting this challenge. In this paper, femtosecond laser with a central wavelength of 1030 nm, a pulse duration 230 fs ablation process for cutting fused silica sheets of thickness 100 μm. To improve cutting quality and efficiency, the experiments through optimization of laser processing parameters, including the laser energy, repetition rate and scanning speed, were carried out. And a two-step processing method was proposed for improving the quality of cross-section surface. According to experimental results, the edge along the edges without chipping and smooth cross-section surface were achieved by this method.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jianfen Zheng, Xiaoyan Sun, Xuye Zhuang, Youwang Hu, and Chang Liang "Femtosecond laser cutting ultra thin fused silica", Proc. SPIE 10964, Tenth International Conference on Information Optics and Photonics, 109644Y (15 November 2018); https://doi.org/10.1117/12.2506222
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