High Volume Producibility And Manufacturing Of Z-Plane Technology

John C. Carson; Stuart N. Shanken

doi:10.1117/12.960387

Translator Disclaimer

13 September 1989 High Volume Producibility And Manufacturing Of Z-Plane Technology

John C. Carson, Stuart N. Shanken

Author Affiliations +

Proceedings Volume 1097, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array; (1989) https://doi.org/10.1117/12.960387
Event: SPIE 1989 Technical Symposium on Aerospace Sensing, 1989, Orlando, FL, United States

Abstract

"Z" technology FPA architectures offer many advantages over planar technologies, stemming from the much larger electronics real estate available for signal conditioning and processing. 'ecause it is an unconventional architecture for FPAs, producibility of Z-plane technology has frequently been called into question. The HYMOSS® Z-plane technology is now used to package computer electronics and will soon enter high volume production for that family of applications. FPA applications will benefit as well as a result of lowered cost, higher reliability, and available productiAl capacity. In addition, new electronic capabilities will continue to accrue from the incorporation of digital processing and sophisticated interconnect technology. The transition to high volume production is described and the ramifications for FPA manufacturing are identified.

Citation Download Citation

John C. Carson and Stuart N. Shanken "High Volume Producibility And Manufacturing Of Z-Plane Technology", Proc. SPIE 1097, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array, (13 September 1989); https://doi.org/10.1117/12.960387

ACCESS THE FULL ARTICLE