Translator Disclaimer
13 September 1989 High Volume Producibility And Manufacturing Of Z-Plane Technology
Author Affiliations +
"Z" technology FPA architectures offer many advantages over planar technologies, stemming from the much larger electronics real estate available for signal conditioning and processing. 'ecause it is an unconventional architecture for FPAs, producibility of Z-plane technology has frequently been called into question. The HYMOSS® Z-plane technology is now used to package computer electronics and will soon enter high volume production for that family of applications. FPA applications will benefit as well as a result of lowered cost, higher reliability, and available productiAl capacity. In addition, new electronic capabilities will continue to accrue from the incorporation of digital processing and sophisticated interconnect technology. The transition to high volume production is described and the ramifications for FPA manufacturing are identified.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John C. Carson and Stuart N. Shanken "High Volume Producibility And Manufacturing Of Z-Plane Technology", Proc. SPIE 1097, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array, (13 September 1989);


Uncooled infrared sensor development trends and challenges
Proceedings of SPIE (September 16 2011)
Far-infrared focal plane development for SIRTF
Proceedings of SPIE (July 01 1992)
Recent Advances In Z-Technology Architecture
Proceedings of SPIE (September 13 1989)
Focal Plane Architecture: An Overview
Proceedings of SPIE (May 07 1980)
Current HYMOSS Z-technology overview
Proceedings of SPIE (November 01 1990)
State of the art in large format IR FPA development...
Proceedings of SPIE (October 10 2003)
Packaging of electronics for on and off FPA signal...
Proceedings of SPIE (November 01 1990)

Back to Top