THz interconnect for inter-/intra-chip communication

Qun Jane Gu; Bo Yu; Xuan Ding; Yu Ye; Xiaoguang Liu; Zhiwei Xu

doi:10.1117/12.2518567

13 May 2019 THz interconnect for inter-/intra-chip communication

Qun Jane Gu, Bo Yu, Xuan Ding, Yu Ye, Xiaoguang Liu, Zhiwei Xu

Proceedings Volume 10982, Micro- and Nanotechnology Sensors, Systems, and Applications XI; 109822R (2019) https://doi.org/10.1117/12.2518567
Event: SPIE Defense + Commercial Sensing, 2019, Baltimore, MD, United States

Abstract

“Interconnect Gap”, caused by the gap between the ever-increasing data rate demand of inter-/intra- chip communications and the insufficient capabilities, has intrigued active research over a decade from both electronics and optics domains, so called electrical interconnect (EI) and optical interconnect (OI). However, it is challenging for both EI and OI to completely address the interconnect issues individually due to their inherent challenges. THz Interconnect (TI), utilizing the frequency spectrum sandwiched between microwave and optical frequencies, holds the high potentials to complement EI and OI by leveraging the advantages of both electronics and optics. Continuous scaling of mainstream silicon technologies enables THz electronics in silicon. On the other hand, THz dielectric waveguides, similar to their optical counterpart fiber, have small dimensions and present low loss at THz frequencies. This paper will present the research activities in the high potential TI field, including high efficiency THz signal generation and modulation circuits, low loss and wide bandwidth THz silicon waveguide channels together with ortho-mode support, and system demonstration of the THz Interconnect for chip to chip communications.

Citation Download Citation

Qun Jane Gu, Bo Yu, Xuan Ding, Yu Ye, Xiaoguang Liu, and Zhiwei Xu "THz interconnect for inter-/intra-chip communication", Proc. SPIE 10982, Micro- and Nanotechnology Sensors, Systems, and Applications XI, 109822R (13 May 2019); https://doi.org/10.1117/12.2518567

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