Image sensor module and a method for evaluating an image sensor

Viktor Goldovsky; Yakov Roizin; Avi Strum; Amos Fenigstein; Yohanan Davidovich; Assaf Lahav; David Avner

doi:10.1117/12.2519626

14 April 2019 Image sensor module and a method for evaluating an image sensor

Viktor Goldovsky, Yakov Roizin, Avi Strum, Amos Fenigstein, Yohanan Davidovich, Assaf Lahav, David Avner

Proceedings Volume 11028, Optical Sensors 2019; 1102819 (2019) https://doi.org/10.1117/12.2519626
Event: SPIE Optics + Optoelectronics, 2019, Prague, Czech Republic

Abstract

An Image Sensor Module (ISM) comprises an Image Sensor Chip (ISC) that typically does not contain information (ISC ID) about the manufacturer and specific process, as well as the data for failure analyses. Similar dice by different manufacturers may differ from each other by their quality and lifespan. Counterfeit ISMs usually exhibit lower performance and quality than the original ones. Installing a counterfeit ISM in an imaging device may dramatically reduce its functionality and reliability. The standard ISC ID technology assumes disassembly of the ISC from the ISM and reverse engineering, or a special electrical readout system, if the information was written in the embedded non- volatile memory. We suggest a simple ISC ID method that features Luminescent Composition (LC) introduced into the lenses and/or color filters of ISC. Chip identification is performed without disassembling of the ISM. In addition, the use of LC allows extending the spectral sensitivity of the ISM with silicon image sensor dice. The design is patented (US10210526) and ready for implementation in the new ISM generation.

Citation Download Citation

Viktor Goldovsky, Yakov Roizin, Avi Strum, Amos Fenigstein, Yohanan Davidovich, Assaf Lahav, and David Avner "Image sensor module and a method for evaluating an image sensor", Proc. SPIE 11028, Optical Sensors 2019, 1102819 (14 April 2019); https://doi.org/10.1117/12.2519626

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KEYWORDS

Image sensors

Ultraviolet radiation

Manufacturing

Semiconducting wafers

Silicon

Deep ultraviolet

Failure analysis

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