Efficient screening of through-silicon-via (TSV) ASICs for CZT x-ray imaging detectors (Conference Presentation)

Daniel Violette; Branden Allen; Jaesub Hong; Jonathan Grindlay

doi:10.1117/12.2529819

9 September 2019 Efficient screening of through-silicon-via (TSV) ASICs for CZT x-ray imaging detectors (Conference Presentation)

Daniel Violette, Branden Allen, Jaesub Hong, Jonathan Grindlay

Author Affiliations +

Proceedings Volume 11118, UV, X-Ray, and Gamma-Ray Space Instrumentation for Astronomy XXI; 1111805 (2019) https://doi.org/10.1117/12.2529819
Event: SPIE Optical Engineering + Applications, 2019, San Diego, California, United States

Abstract

The High Resolution Energetic X-ray Imager (HREXI) is a coded-aperture imaging telescope that utilizes tiled CdZnTe (CZT) detectors to image cosmic x-ray sources and transients in the 3-200 keV energy band. A closely tiled array of 256 pixellated CZT detectors form the 1024 cm^2 detector plane of a proposed (Grindlay et al. 2019) SmallSat mission. This close tiling of the crystal units is achieved by Through-Silicon-Via (TSV) enabled readout ASICs that shrink the readout electronics footprint of the wire-bonded ASICs previously developed and incorporated on the Nuclear Spectroscopic Telescope Array (NuSTAR) mission. To close-tile large numbers of detectors, an efficient die-level ASIC screening method is required for the TSV-ASICs. The ASIC Test Stand (ATS) was developed (Violette et al. 2018, SPIE Proceedings) in order to enable rapid testing of die-level TSV-ASICs by precision alignment of a fixed array of spring-loaded pogo-pin probes to connect to the ASIC's 87 pads with a 225 micron pitch. Here we report ATS design improvements and results from testing ASIC energy resolution and stability using the commandable test pulser internal to the ASIC. Multiple ATS systems will enable rapid testing and selection of ASICs for large area detector arrays as needed for the HREXI SmallSat Prototype (HSP).

Conference Presentation

Citation Download Citation

Daniel Violette, Branden Allen, Jaesub Hong, and Jonathan Grindlay "Efficient screening of through-silicon-via (TSV) ASICs for CZT x-ray imaging detectors (Conference Presentation)", Proc. SPIE 11118, UV, X-Ray, and Gamma-Ray Space Instrumentation for Astronomy XXI, 1111805 (9 September 2019); https://doi.org/10.1117/12.2529819

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KEYWORDS

Sensors

Image sensors

X-ray imaging

Crystals

Electronics

Image resolution

Spectroscopy

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