Presentation + Paper
24 October 2019 Stochastic printing behavior of ML-defects on EUV mask
Author Affiliations +
Abstract
One of the residual concerns for use of EUV patterning for IC manufacturing is its stochastic behavior. The present paper specifically studies the contribution of mask defects to the stochastic failure rate, with a focus on defects related to the multilayer mirror of the mask, so-called ML-defects. By simulation, a universal relation is obtained between the probability that a given mask defect triggers a stochastic failure on wafer and the average local CD deviation that it causes. Even marginal ML-defects, which cause less than 10% CD deviation, are shown to act as trigger points for locally increased failure probability. This finding is supported by experimental data based on AIMS EUV aerial image measurements in scanner photon stochastics emulation mode. In addition, other local defect types on mask are shown to behave in the same way. Non-local mask deficiencies, such as line-edge roughness and contamination effects, can influence the contribution of the mask to the stochastic failure rate of the printed image on wafer.
Conference Presentation
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rik Jonckheere, Lawrence S. Melvin III, and Renzo Capelli "Stochastic printing behavior of ML-defects on EUV mask", Proc. SPIE 11147, International Conference on Extreme Ultraviolet Lithography 2019, 111470P (24 October 2019); https://doi.org/10.1117/12.2538153
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CITATIONS
Cited by 1 scholarly publication and 4 patents.
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KEYWORDS
Stochastic processes

Photomasks

Failure analysis

Extreme ultraviolet

Printing

Critical dimension metrology

Extreme ultraviolet lithography

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