Evaluation of local CD and placement distribution on EUV mask and its impact on wafer

Vidya Vaenkatesan; Paul van Adrichem; Marleen Kooiman; Michael Kubis; Lieve van Look; Andreas Frommhold; Emily Gallagher; DS Nam; Jan Mulkens

doi:10.1117/12.2538243

27 June 2019 Evaluation of local CD and placement distribution on EUV mask and its impact on wafer

Vidya Vaenkatesan, Paul van Adrichem, Marleen Kooiman, Michael Kubis, Lieve van Look , Andreas Frommhold, Emily Gallagher, DS Nam, Jan Mulkens

Author Affiliations +

Proceedings Volume 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology; 1117807 (2019) https://doi.org/10.1117/12.2538243
Event: Photomask Japan 2019, 2019, Yokohama, Japan

Abstract

The mask is a known contributor to intra-field fingerprints at the wafer level. Traditionally, a 3σ distribution of critical dimensions (CDs) on mask was considered sufficient to characterize the contribution to the CD distribution at wafer level. Recent studies report wafer local CD distributions characterized for statistics beyond 3σ¹. Mask has been shown to contribute to wafer local CD distribution also which is typically quantified as Local CD Uniformity (LCDU), a 3σ metric². Additionally, the local placement distribution on wafer could be a contributor to Edge Placement Error (EPE)³. Consequently, it is imperative to understand, characterize and ultimately control the mask contributions to local CD and placement distribution at wafer level. This work is an investigation of local CD and placement distribution on an EUV mask and its impact on distributions at wafer level.

Citation Download Citation

Vidya Vaenkatesan, Paul van Adrichem, Marleen Kooiman, Michael Kubis, Lieve van Look , Andreas Frommhold, Emily Gallagher, DS Nam, and Jan Mulkens "Evaluation of local CD and placement distribution on EUV mask and its impact on wafer", Proc. SPIE 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology, 1117807 (27 June 2019); https://doi.org/10.1117/12.2538243

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

;

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE