High quality Bessel beam generation through reflective axicon for femtosecond laser glass microprocessing (Conference Presentation)

Antonin Billaud; Maik Steinbach; Patrick Taschner; Arndt Hohnholz; Gwenn Pallier; Sami Laroui; Pu Jian; Olivier Pinel; Jürgen Koch; Guillaume Labroille

doi:10.1117/12.2545860

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9 March 2020 High quality Bessel beam generation through reflective axicon for femtosecond laser glass microprocessing (Conference Presentation)

Antonin Billaud, Maik Steinbach, Patrick Taschner, Arndt Hohnholz, Gwenn Pallier, Sami Laroui, Pu Jian, Olivier Pinel, Jürgen Koch, Guillaume Labroille

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Proceedings Volume 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV; 112670C (2020) https://doi.org/10.1117/12.2545860
Event: SPIE LASE, 2020, San Francisco, California, United States

Abstract

With the development of touch panel display the need to process thinner glass using Ultra-Short Pulse (USP) laser has increased. Beam shaping improves the process yield and quality but requires specific precautions when applied to USP laser due to high peak power and dispersion. Bessel beams improve the quality of glass drilling and cutting due to the extended depth of field. We present Bessel beam generation using a reflective off-axis axicon giving a more stable beam compatible with scanning system and with a profile closer to theory. The characteristics of the beam and of the processed glass are described.

Conference Presentation

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Antonin Billaud, Maik Steinbach, Patrick Taschner, Arndt Hohnholz, Gwenn Pallier, Sami Laroui, Pu Jian, Olivier Pinel, Jürgen Koch, and Guillaume Labroille "High quality Bessel beam generation through reflective axicon for femtosecond laser glass microprocessing (Conference Presentation)", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 112670C (9 March 2020); https://doi.org/10.1117/12.2545860

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