Processing bulk silicon with femtosecond laser pulses at 2-µm wavelength (Conference Presentation)

Maxime Chambonneau; Markus Blothe; Vladimir Yu. Fedorov; Tobias Heuermann; Gabor Matthäus; Alessandro Alberucci; Jens Limpert; Stylianos Tzortzakis; Stefan Nolte

doi:10.1117/12.2545820

9 March 2020 Processing bulk silicon with femtosecond laser pulses at 2-µm wavelength (Conference Presentation)

Maxime Chambonneau, Markus Blothe, Vladimir Yu. Fedorov, Tobias Heuermann, Gabor Matthäus, Alessandro Alberucci, Jens Limpert, Stylianos Tzortzakis, Stefan Nolte

Author Affiliations +

Proceedings Volume 11270, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX; 112700E (2020) https://doi.org/10.1117/12.2545820
Event: SPIE LASE, 2020, San Francisco, California, United States

Abstract

We investigate the possibilities offered by tightly focused ultrashort laser pulses at 2-µm wavelength for modifying the bulk of silicon. Results show that the lower the pulse duration, the lower the probability to modify the material, in good agreement with nonlinear propagation simulations. By evaluating the influence of several laser parameters, we have found ideal conditions for successfully initiating modifications systematically in the bulk of silicon with ultrashort laser pulses through plane surface for the first time. This result holds promises for contactless monolithic integration of three-dimensional architectures inside silicon.

Conference Presentation

Citation Download Citation

Maxime Chambonneau, Markus Blothe, Vladimir Yu. Fedorov, Tobias Heuermann, Gabor Matthäus, Alessandro Alberucci, Jens Limpert, Stylianos Tzortzakis, and Stefan Nolte "Processing bulk silicon with femtosecond laser pulses at 2-µm wavelength (Conference Presentation)", Proc. SPIE 11270, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XX, 112700E (9 March 2020); https://doi.org/10.1117/12.2545820

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