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25 February 2020 Optimization of solder reflow processing and part design in thermoplastic optical interconnect components
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Abstract
Thermoplastic polyetherimides (ULTEM™ and EXTEM™ resins) have been used to produce complex optical lenses and ferrules that are integrated in optical interconnect sub-assemblies. Current thermoplastic optics must be added separately to prevent dimensional changes from the 260°C peak temperature of a solder reflow process. This paper covers injection molding parameters and solder reflow conditions that influence optical properties and dimensional stability of solder-reflowable test components.
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peter M. Johnson, Takamune Sugawara, Norihiko Ohno, and Gabrie Hoogland "Optimization of solder reflow processing and part design in thermoplastic optical interconnect components", Proc. SPIE 11283, Integrated Optics: Devices, Materials, and Technologies XXIV, 112831U (25 February 2020); https://doi.org/10.1117/12.2543215
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