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28 February 2020 Integrated silicon photonics for high-volume data center applications
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Proceedings Volume 11286, Optical Interconnects XX; 112860M (2020) https://doi.org/10.1117/12.2550326
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
The rapid growth in data center traffic is driving the need for increased performance and overall bandwidth of networking equipment, including optical interfaces and Ethernet switches, which are based on pluggable transceivers today. But looking just a few years ahead, bandwidth scalability challenges are looming in terms of density, cost, and power; challenges that require tighter integration of optics and networking silicon. This paper reviews the motivation for integration, the enabling technology elements, and discusses how advanced packaging and Silicon Photonics enable higher density, reduced power per bit, and ultimately the continued scalability of network bandwidth and performance.
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© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert Blum "Integrated silicon photonics for high-volume data center applications", Proc. SPIE 11286, Optical Interconnects XX, 112860M (28 February 2020); https://doi.org/10.1117/12.2550326
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