Translator Disclaimer
Presentation
9 March 2020 Highest accuracy passive alignment: a reliable and cost-effective approach for silicon photonic systems (Conference Presentation)
Author Affiliations +
Proceedings Volume 11286, Optical Interconnects XX; 1128613 (2020) https://doi.org/10.1117/12.2551485
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
One of the main challenges in the assembly of Silicon Photonics components in optoelectronic systems, is the very precise bonding of the dies and their interconnection. Not only is the necessary accuracy much higher than for other conventional optical systems, but from an industrial/business perspective, the high throughput is key. This can be achieved by a combination of techniques, using highest end passive alignment processes, whereby spread of positioning accuracy, below 1.5 µm aim for the best of two worlds: low loss coupling and high throughput. Such accuracy can be reached using highest-end dedicated equipment, whereby the alignment time can be reduced by a factor of 2 to 3 in comparison with active alignment methods.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dan Negrea and Robert Giertz "Highest accuracy passive alignment: a reliable and cost-effective approach for silicon photonic systems (Conference Presentation)", Proc. SPIE 11286, Optical Interconnects XX, 1128613 (9 March 2020); https://doi.org/10.1117/12.2551485
PROCEEDINGS
PRESENTATION


SHARE
Advertisement
Advertisement
Back to Top