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24 February 2020 Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation
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Abstract
TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40˚C to 125˚C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina’s selfhermetic flip-chip VCSEL are discussed. TriLumina’s VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas R. Fanning, John Maynard, Christopher J. Helms, Lei Yang, David Podva, Jeff Earls, Jacob Lopez, Michael Chung, James Foresi, Mial E. Warren, and Gianluca Bacchin "Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation", Proc. SPIE 11300, Vertical-Cavity Surface-Emitting Lasers XXIV, 1130002 (24 February 2020); https://doi.org/10.1117/12.2546689
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