Perspectives and tradeoffs of novel absorber materials for high NA EUV lithography (Conference Presentation)

Andreas Erdmann; Hazem Mesilhy; Peter Evanschitzky; Vicky Philipsen; Frank Timmermans; Markus Bauer

doi:10.1117/12.2550882

24 March 2020 Perspectives and tradeoffs of novel absorber materials for high NA EUV lithography (Conference Presentation)

Andreas Erdmann, Hazem Mesilhy, Peter Evanschitzky, Vicky Philipsen, Frank Timmermans, Markus Bauer

Author Affiliations +

Proceedings Volume 11323, Extreme Ultraviolet (EUV) Lithography XI; 1132309 (2020) https://doi.org/10.1117/12.2550882
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

Pushing the novel anamorphic NA=0.55 EUV projection optics to k1 values below 0.4 and to its ultimate resolution limit will require an alternative mask absorber stack. This paper describes the application of rigorous imaging simulations in combination with multi-objective optimization to access the performance of novel absorber materials for the NA=0.55 system. Simulations of various use cases and material options indicate two main types of solutions: high k materials (k>0.05, especially for vertical lines/spaces) and low n materials (n ~ 0.9) to provide phase shift mask solutions for contact arrays.

Conference Presentation

Citation Download Citation

Andreas Erdmann, Hazem Mesilhy, Peter Evanschitzky, Vicky Philipsen, Frank Timmermans, and Markus Bauer "Perspectives and tradeoffs of novel absorber materials for high NA EUV lithography (Conference Presentation)", Proc. SPIE 11323, Extreme Ultraviolet (EUV) Lithography XI, 1132309 (24 March 2020); https://doi.org/10.1117/12.2550882

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