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2 April 2020 Key technology developments of active optical package (AOP) substrate for co-packaging of silicon photonics
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Abstract
In high performance computer systems and large-scale data centers, data movement becomes a critical problem. To overcome this problem, co-packaging technology, which realizes high density integration of optical modules and switch ASICs (application specific integrated circuits) in one small package, is attracted much attention. Due to the multiple photonics dies and the ASICs are integrated in a small volume, low-latency, high-bandwidth-density and low-power data transfer can be realized. To provide the co-packaging technology compatible with standard large-scale integration (LSI) packaging process, we have proposed a new package substrate called active optical package (AOP) substrate. The AOP substrate is an organic package substrate where Si photonics dies are embedded. On the surface of the substrate, fan-out polymer waveguides, connecting high density Si-photonics I/O and low density single-mode fiber array, are integrated. The polymer waveguides and the SMF is connected using an optical connector at the edge of the AOP substrate. Thus, the AOP substrate will be used as same as conventional standard package substrates. Only a different point is to connect a pluggable optical fiber. In this paper, we introduce some key technologies for the AOP substrate.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
A. Noriki, I. Tamai, Y. Ibusuki, A. Ukita, Satoshi Suda, D. Shimura, Y. Onawa, H. Yaegashi, T. Amano, and M. Mori "Key technology developments of active optical package (AOP) substrate for co-packaging of silicon photonics", Proc. SPIE 11364, Integrated Photonics Platforms: Fundamental Research, Manufacturing and Applications, 113640S (2 April 2020); https://doi.org/10.1117/12.2559611
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