CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 11364 > Article
Presentation
2 April 2020 CORNERSTONE’s silicon photonics prototyping platform: present status and future outlook (Conference Presentation)
Callum G. Littlejohns, Ying Tran, Han Du, Mehdi Banakar, Xingzhao Yan, Marc Sorel, Frederic Gardes, Dave Thomson, Goran Mashanovich, Graham T. Reed
Author Affiliations +
Proceedings Volume 11364, Integrated Photonics Platforms: Fundamental Research, Manufacturing and Applications; 113640T (2020) https://doi.org/10.1117/12.2559132
Event: SPIE Photonics Europe, 2020, Online Only
Abstract
As the market adoption of silicon photonics technologies continues to rise, and ever more fabless companies enter the market, there is a clear need for a flexible device prototyping foundry service that retains the ability for device level innovation, whilst also offering a clear route to market. The CORNERSTONE platform offers an affordable multi-project-wafer (MPW) service that allows a degree of customisation, which may not be accessible at other foundries. Through the use of DUV projection lithography, fabrication processes can be easily transferred to other foundries for mass production. Additionally, the ability to exploit high resolution e-beam lithography for certain layers mimics more advanced technology nodes, should this be deemed necessary. Several silicon-on-insulator platforms enable a plethora of applications including datacoms, LIDAR and mid-IR sensing. This talk gives an overview of the present status of the CORNERSTONE platforms, and an outlook for the future.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Callum G. Littlejohns, Ying Tran, Han Du, Mehdi Banakar, Xingzhao Yan, Marc Sorel, Frederic Gardes, Dave Thomson, Goran Mashanovich, and Graham T. Reed "CORNERSTONE’s silicon photonics prototyping platform: present status and future outlook (Conference Presentation)", Proc. SPIE 11364, Integrated Photonics Platforms: Fundamental Research, Manufacturing and Applications, 113640T (2 April 2020); https://doi.org/10.1117/12.2559132
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 PRESENTATION
WATCH
PRESENTATION SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
KEYWORDS
Prototyping
Silicon photonics
Data communications
Deep ultraviolet
Electron beam lithography
LIDAR
Mid-IR
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top