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2 April 2020 CORNERSTONE’s silicon photonics prototyping platform: present status and future outlook (Conference Presentation)
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As the market adoption of silicon photonics technologies continues to rise, and ever more fabless companies enter the market, there is a clear need for a flexible device prototyping foundry service that retains the ability for device level innovation, whilst also offering a clear route to market. The CORNERSTONE platform offers an affordable multi-project-wafer (MPW) service that allows a degree of customisation, which may not be accessible at other foundries. Through the use of DUV projection lithography, fabrication processes can be easily transferred to other foundries for mass production. Additionally, the ability to exploit high resolution e-beam lithography for certain layers mimics more advanced technology nodes, should this be deemed necessary. Several silicon-on-insulator platforms enable a plethora of applications including datacoms, LIDAR and mid-IR sensing. This talk gives an overview of the present status of the CORNERSTONE platforms, and an outlook for the future.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Callum G. Littlejohns, Ying Tran, Han Du, Mehdi Banakar, Xingzhao Yan, Marc Sorel, Frederic Gardes, Dave Thomson, Goran Mashanovich, and Graham T. Reed "CORNERSTONE’s silicon photonics prototyping platform: present status and future outlook (Conference Presentation)", Proc. SPIE 11364, Integrated Photonics Platforms: Fundamental Research, Manufacturing and Applications, 113640T (2 April 2020);

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