This paper extends the 2019 findings, that local defects on an EUV mask are trigger points for stochastic failures on the printed wafer, to a simulation study of non-local mask deficiencies. These relate to shortcomings of a larger area nature where the reticle deviates from an ideal reticle or fails specification. These include aspects such as global CD error, absorber slope, contamination effects, line edge roughness, and multilayer roughness. The presented results suggest that mask specifications may need refinement, specifically for roughness type deficiencies, in order to help mitigate the mask contribution in the stochastics of wafer printing by EUV lithography.
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